• Thermal profile qualified for leaded or lead free (RoHS) reflow and for adhesive curing (for surface mount components which will be wave soldered together with inserted components)
   
• Many ovens with different number of zones (up to 7)
   
• Possibility of intrusive soldering of inserted parts (pin in paste, or pin through paste)
   
• Real time thermal profiling with thermocouples

Are required from the customer

• Specific thermal profile requirement and moisture sensitive level (MSL) applicable to any sensitive part to be reflowed.