• Paste printing 
   
  • unleaded (RoHS) alloy (SAC305, SN100C)
  • Soluble or no clean flux
  • solder balls from 30µm to 60 µm
     
• Adhesive printing
   
  • For parts larger or equivalent to 0603, SOT-23
  • which will be wave soldered together with inserted components
     
• Maximum printed image size of 11" x 16" (30cm x 40cm)
   
• Possibility of sharing top and bottom images on the same stencil if each image is smaller than 11" x 5"
   
• Systematic visual inspection of patterns covered by the component (eg. BGA, LGA, QFN, etc)
   
• Standard laser cut, electropolished, stainless steel stencil.  Electroformed or nickel plated stencil as required.  Typical thicknesses of 0.004" to 0.012" (100um à 300um).
   
• Pad openings as small as 0.006" (150um)
   
• Pads spacing as small as 0.006" (150um)

Are required from the customer

• Paste mask Gerber file for each of assembled surface